Development of a Low-Cost Precision Drop Tester Integrating Digital Height Measurement and Rapid Release Mechanism for Academic Packaging Labs
Keywords:
drop tester, low cost, ASTM D5276, finite element analysis, microcontrollerAbstract
Drop testing is a key method in evaluating the mechanical durability of packaging and products during distribution. This research develops a low-cost drop tester prototype that is precise and applicable for academic environments, referring to ASTM D5276 and ISTA standards. The integrative design using CAD/CAE and FEA simulation ensures the mechanical strength and reliability of the structure, while the electronic system based on microcontroller and ultrasonic sensor supports digital drop height measurement and deformation monitoring through high-speed camera. Experimental validation shows an average fall height deviation of less than 1 mm with stable fall orientation and quick release mechanism. Weaknesses such as the absence of arm height limit, limitations of the load cell sensor in recording load peaks, and the need for lubrication and maintenance of the slider are the focus of further development. Recommendations include full automation of data logging and application of AI for video analysis of the test process. This prototype has the potential to improve the quality of practicum learning and open up space for research development and packaging industry applications.
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[1] ASTM, “ASTM D5276-19: Standard Test Method for Drop Test of Loaded Containers by Free Fall,” American Society for Testing and Materials. Accessed: Oct. 16, 2025. [Online]. Available: https://www.scribd.com/document/611382617/ASTM-D5276-19
[2] International Safe Transit Association, “International Safe Transit Association (ISTA): Product or Packaged-Product in Mechanically Handle Bulk Transport Containers,” Jan. 2025. Accessed: Oct. 16, 2025. [Online]. Available: https://ista.org/docs/3Hoverview.pdf
[3] A. Kurniawan, P. Marwoto, and S. E. Nugroho, “Development and Validation of Free Fall Motion Experiment Kit Based on Arduino UNO and Phyphox Application,” Jurnal Pendidikan MIPA, vol. 26, no. 1, pp. 62–74, Feb. 2025, doi: 10.23960/JPMIPA.V26I1.PP62-74.
[4] J. E. Holt and D. Schoorl, “A NEW DROP TESTER,” 2015.
[5] Lansmont, “Drop tester equipment: features, models and functionality,” Lansmont Technical Whitepaper, 2025. Accessed: Oct. 16, 2025. [Online]. Available: https://www.lansmont.com/products/drop-testers
[6] International Safe Transit Association, “ISTA Series 6: 6-FEDEX-A Testing vs. Standard UN Testing.” Accessed: Oct. 16, 2025. [Online]. Available: https://www.thecompliancecenter.com/ista-series-6-6-fedex-a-testing-vs-standard-un-testing/
[7] Bappenas, “Sustainable Development Goals (SDGs) – SDGs Indonesia,” Badan Perencanaan Pembangunan Nasional. Accessed: Oct. 16, 2025. [Online]. Available: https://sdgs.bappenas.go.id/tag/sustainable-development-goals-sdgs/
[8] J. Pries-Heje, R. Baskerville, and J. R. Venable, “Strategies for Design Science Research Evaluation,” 2008. [Online]. Available: http://aisel.aisnet.org/ecis2008/87
[9] Pacorr Testing Instruments, “A Deep Dive into the Package Drop Testing Method for Robust Packaging.” Accessed: Oct. 16, 2025. [Online]. Available: https://www.pacorr.com/blog/package-drop-testing-method-for-robust-packaging/
[10] M. Müller and E. Wings, “An Architecture for Hybrid Manufacturing Combining 3D Printing and CNC Machining,” International Journal of Manufacturing Engineering, vol. 2016, pp. 1–12, Oct. 2016, doi: 10.1155/2016/8609108.
[11] R. G. R. Saputra and T. Naziha, “Secondary Packaging Performance Assessment Based on Mechanical Damage Resistance Using Drop Testing and Forensic Packaging Methods at CV. Mubarokfood Cipta Delicia,” Agroindustrial Journal, vol. 12, no. 1, pp. 1–15, Jun. 2025, doi: 10.22146/AIJ.V12I1.100011.
[12] U. Maheswari, “Performing a Drop Test in SolidWorks: A Step-by-Step Guide,” Skill-Lync. Accessed: Oct. 16, 2025. [Online]. Available: https://skill-lync.com/blogs/performing-a-drop-test-insolidworks-a-step-by-step-guide
[13] A. Muhammad et al., “Investigating the effects of partitioning temperature fluctuations on the mechanical properties of ASTM A36 carbon steel using Q-P-T heat treatment: an experimental study,” Disseminating Information on the Research of Mechanical Engineering-Jurnal Polimesin, vol. 22, no. 3, 2024, [Online]. Available: http://e-jurnal.pnl.ac.id/polimesin
[14] P. S. Frima Yudha and R. A. Sani, “IMPLEMENTASI SENSOR ULTRASONIK HC-SR04 SEBAGAI SENSOR PARKIR MOBIL BERBASIS ARDUINO,” EINSTEIN e-JOURNAL, vol. 5, no. 3, Jan. 2019, doi: 10.24114/einstein.v5i3.12002.
[15] R. Afiq, W. Amien, and D. A. Hidayatno, “IMPLEMENTASI MIKROKONTROLER ARDUINO UNO DAN MINI-COMPUTER RASPBERRY PI 3 DALAM PENGENDALIAN SISTEM GERBANG TOL CERDAS,” TRANSIENT, vol. 8, no. 1, Mar. 2019, [Online]. Available: https://ejournal3.undip.ac.id/index.php/transient
[16] S. Upcraft and R. Fletcher, “Tutorial The rapid prototyping technologies,” Assembly Automation, vol. 23, pp. 318–330, 2003, [Online]. Available: http://www.emeraldinsight.com/researchregisterhttp://www.emeraldinsight.com/0144-5154.htm
[17] N. Lengas, K. Müller, E. Schlick-Hasper, M. Neitsch, S. Johann, and M. W. Zehn, “Drop Test Simulation of Packaging for Dangerous Goods: An Investigation of Appropriate Drop Height Adjustment in Case of Deviating Packaging Gross Mass,” Jan. 01, 2025, John Wiley and Sons Ltd. doi: 10.1002/pts.2858.
[18] O. Oktay, G. Koçak, and S. Seven, “The Impact of STEM-based laboratory activities on pre-service science teachers’ competence perceptions in 21st-Century Skills and STEM Awareness,” Journal of Science Learning, vol. 6, no. 3, pp. 244–255, Jul. 2023, doi: 10.17509/jsl.v6i3.54992.
[19] P. Böröcz and Z. Németh, “Review Paper on the Field Measurement of Parcel Packaging Drop for Testing Purposes,” Packaging Technology and Science, vol. 38, no. 5, pp. 345–357, May 2025, doi: 10.1002/PTS.2875.
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Copyright (c) 2025 Dani Ralisnawati, Muhammad Prasetya Kurniawan, Desy Setioningrum, Ratdiyanti Puji Astuti
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